Browse Prior Art Database

Partially Encapsulated, Cleavable, Controlled Collapse Chip Connections

IP.com Disclosure Number: IPCOM000107497D
Original Publication Date: 1992-Feb-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Mok, LS: AUTHOR [+2]

Abstract

Disclosed is the structure of partially encapsulated, cleavable, controlled collapse chip connection (PEC5) joints. The crosssectional view of the PEC5 joints on a substrate is shown in the figure. The semiconductor chips 11 have circuitry built in and have connection pads where the high-melting-point solder columns 13 reside on. The solder columns 13 are surrounded by a layer of encapsulant 12. The solder columns could be 97Pb-3Sn and the encapsulant could be Upilex or Xyder. Layers of interface metals which are not shown in the figure are added between the solder columns and the chip connection pads. The solder balls 14 are placed under the solder columns 13. They are made of relatively lowmelting-point solder such as eutectic Pb/Sn solder. The solder balls 14 are bonded on the connection pads 15 on the substrate 16.

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Partially Encapsulated, Cleavable, Controlled Collapse Chip Connections

      Disclosed is the structure of partially encapsulated,
cleavable, controlled collapse chip connection (PEC5) joints. The
crosssectional view of the PEC5 joints on a substrate is shown in the
figure. The semiconductor chips 11 have circuitry built in and have
connection pads where the high-melting-point solder columns 13 reside
on. The solder columns 13 are surrounded by a layer of encapsulant
12. The solder columns could be 97Pb-3Sn and the encapsulant could be
Upilex or Xyder. Layers of interface metals which are not shown in
the figure are added between the solder columns and the chip
connection pads. The solder balls 14 are placed under the solder
columns 13. They are made of relatively lowmelting-point solder such
as eutectic Pb/Sn solder. The solder balls 14 are bonded on the
connection pads 15 on the substrate 16. Note that the solder balls 14
are not encapsulated so that they can be reworked or repaired with
conventional methods.

      Disclosed anonymously.