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Hole Fabrication in Thin Film using Magnetic Repulsion Punching

IP.com Disclosure Number: IPCOM000107532D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 3 page(s) / 109K

Publishing Venue

IBM

Related People

Beers, HW: AUTHOR [+3]

Abstract

Disclosed is the design of a magnetic repulsion coil matrix used to drive a high density and high frequency die and punch assembly to fabricate holes in thin film.

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Hole Fabrication in Thin Film using Magnetic Repulsion Punching

       Disclosed is the design of a magnetic repulsion coil
matrix used to drive a high density and high frequency die and punch
assembly to fabricate holes in thin film.

      Magnetic repulsion technology is capable of providing high
frequency punching but is very exothermic and difficult to package.
This design required a punch assembly center distance of
approximately 10 mm and is expandable to a 256 punch matrix in the
x-y plane.  The heat generated by each coil assembly is approximately
100 watts. Heat transfer into the punch assembly was limited to 2
degrees F in order to eliminate substrate damage.  Water was used to
cool the coil assembly.

      The layout of Fig. 1 shows a crossection of the coil head
assembly. Removable sealed contact rod 1 conducts the current from
male contact 2 to foil wrapped coil 3.  The ground rod 4 is shown
attached to coil 3.  Liquid coolant in chamber 5 is forced through
annulus 6 and tubular channel 7 created by contact rod 1 and coil
upstop 8.  Fluid is then forced into coil recess 9 through the finned
area of coil 11 and out to the exit chamber 12 by tubular channel 13.

      Fig. 2 shows a top view of Fig. 1, i.e.,  from the contact 2
end.  The grid shown is expandable since ground pin 14 is centered
relative to the coils 3. Ground strap 16 permits four coils to be
powered by one capacitor (not shown). However, only one coil assembly
can be fir...