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Browse Prior Art Database

Power Module Packaging for Magnetic Repulsion Punching

IP.com Disclosure Number: IPCOM000107534D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Feinstein P, Jr: AUTHOR [+3]

Abstract

Disclosed is the packaging of the capacitor and silicon-controlled rectifier (SCR) components of the driver electronics for Magnetic Repulsion (MR) hole punching tools. These prototype tools have been used for punching holes in KAPTON*, High Density Carrier (HDC) and greensheet substrates. The punch driver circuit charges up the capacitor and turns the SCR on to dump the energy from the capacitor to the punch coil (not shown). This fast, high current pulse in the coil causes the copper disc (not shown) which is adjacent to the coil to move away at a very high velocity. The punch is attached to the copper disc. The capacitor and SCRs should be mounted in close proximity to the coil assembly that drives the punches, since the power loss and resultant temperature rise at 1000 amps per coil is significant.

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This is the abbreviated version, containing approximately 62% of the total text.

Power Module Packaging for Magnetic Repulsion Punching

       Disclosed is the packaging of the capacitor and
silicon-controlled rectifier (SCR) components of the driver
electronics for Magnetic Repulsion (MR) hole punching tools. These
prototype tools have been used for punching holes in KAPTON*, High
Density Carrier (HDC) and greensheet substrates.  The punch driver
circuit charges up the capacitor and turns the SCR on to dump the
energy from the capacitor to the punch coil (not shown).  This fast,
high current pulse in the coil causes the copper disc (not shown)
which is adjacent to the coil to move away at a very high velocity.
The punch is attached to the copper disc.  The capacitor and SCRs
should be mounted in close proximity to the coil assembly that drives
the punches, since the power loss and resultant temperature rise at
1000 amps per coil is significant.  This is accomplished by stacking
the electrical components of the power module, thereby greatly
reducing the footprint approximately 23 mm by 60 mm which allows the
module to be mounted directly on the punch and die, also reducing the
length of the high voltage power lines.  Additionally, the power
module is pluggable and easily accessible, which improves
manufacturability and serviceability.

                            (Image Omitted)

      The power module in the figure can direct power to any of four
coils (not shown).  Each module contains one capacitor 9 and four
...