Browse Prior Art Database

Adapter for Solder Ball Connection Module to Facilitate Automated Placement During Card Assembly

IP.com Disclosure Number: IPCOM000107536D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Prime, R: AUTHOR [+3]

Abstract

This adapter will allow a solder ball connection (SBC) module to be transferred from a tray by automated placement equipment. Now SBC Modules can be handled in the manufacturing environment like other SMT components.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Adapter for Solder Ball Connection Module to Facilitate Automated Placement During Card Assembly

       This adapter will allow a solder ball connection (SBC)
module to be transferred from a tray by automated placement
equipment.  Now SBC Modules can be handled in the manufacturing
environment like other SMT components.

      In this specific embodiment, an adapter boat (Fig. 1) is picked
up from a tray position by the transfer robot vacuum post at "A".  It
is placed in the shuttle and centered within the shuttle by movement
of the shuttle positioners (fingers) against the adapter boat sides,
"B". The slanted, inner sides, "E", of the adapter boat are used to
center the SBC module after it is picked up by the transfer robot.

      Next, using an algorithm with the vision system that calculates
the center of the module, the SBC module will be brought to the nest
block on the feeder (Fig. 2).  The wedges perform the final alignment
adjustment by using the SBC balls themselves for alignment.  The
module can then be placed accurately on the panel.

      When all the SBC Modules are placed, the pick-up head will
remove the adapter boat from the shuttle by picking it up at "A" and
placing it at a fixed, storage location.  The automatic placement
equipment can start placing other SMT components.