Browse Prior Art Database

Method to Qualify Photomask Reticles in a Semiconductor Wafer Manufacturing Line

IP.com Disclosure Number: IPCOM000107540D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Lamande, JD: AUTHOR [+2]

Abstract

Reticle qualification is a manufacturing operation required by every semiconductor wafer manufacturing line. The proposed method provides a simple, cheap and efficient solution based on a chip-to-chip control to obtain a reticle having the same visual features as the one used on the wafer manufacturing line. The sequence of steps is illustrated by the flow chart in the figure.

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Method to Qualify Photomask Reticles in a Semiconductor Wafer Manufacturing Line

       Reticle qualification is a manufacturing operation
required by every semiconductor wafer manufacturing line. The
proposed method provides a simple, cheap and efficient solution based
on a chip-to-chip control to obtain a reticle having the same visual
features as the one used on the wafer manufacturing line. The
sequence of steps is illustrated by the flow chart in the figure.

      The first step of the method consists of the exposition of the
reticle qualified during its use on the wafer manufacturing line on a
half of a chromium-plated glass device. The device has been coated
with the resin usually used after an exposition operation. Then, on
the stepper, the qualified reticle is replaced by the reticle to be
qualified, and the second part of the device is exposed. Once the
exposition has been performed, the resin is developed and the process
generally used to manufacture masks is applied to the device: etching
of the chromium, stripping of the resin, and cleaning (if necessary).
Next, a control is performed to find the differences between a cell
of the qualified reticle and a cell of the reticle to be qualified.
This control has to be performed on several cells to take into
account the process effects and to increase the likelihood of finding
a defect in the reticle. After the scanning of the device, the
defects identified by the control tool are analyzed to decide whether
...