Browse Prior Art Database

Passivation of Raw Board Edge by Fusing

IP.com Disclosure Number: IPCOM000107599D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Davis, CR: AUTHOR [+6]

Abstract

Disclosed is a tool that allows the edges of a fluoropolymer composite with multilayer circuitry to be sealed. This provides electrical and environmental isolation to prevent shorting between planes. The device is designed to confine the heat that could damage the active area of the raw board, to the extreme edge of the panel. Enough heat and pressure is at this area to seal the edge, but not transmitted to the circuitized area.

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Passivation of Raw Board Edge by Fusing

       Disclosed is a tool that allows the edges of a
fluoropolymer composite with multilayer circuitry to be sealed.  This
provides electrical and environmental isolation to prevent shorting
between planes.  The device is designed to confine the heat that
could damage the active area of the raw board, to the extreme edge of
the panel.  Enough heat and pressure is at this area to seal the
edge, but not transmitted to the circuitized area.

      Polytetrafluoroethylene (PTFE) will melt and flow at
temperatures in excess of 390 degrees centigrade and pressures at or
above 500 PSI.  A clamping pressure of 60 seconds is satisfactory
using the device.

      The sequence of events is as follows.  The heater block 5 along
with the cartridge heaters 4 are brought up to a predetermined
temperature.  The insulator 3 isolates the heater block from the
cylinder support 2 to keep the heat concentrated in the heater block.
The cylinder 1 is actuated downward.  The angled non-stick surfaces
on the heater block contact the corner of the part 6.  As pressure
and elevated temperatures work together, the voltage plane voids 7
are sealed as the PTFE material flows.