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Browse Prior Art Database

Pin Repair Assembly with a Solderless Innerface

IP.com Disclosure Number: IPCOM000107683D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Bundga, EG: AUTHOR

Abstract

Disclosed is a device that provides a different method of bonding two wires together without the use of welding or soldering.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Pin Repair Assembly with a Solderless Innerface

       Disclosed is a device that provides a different method of
bonding two wires together without the use of welding or soldering.

      The application is primarily for a single pin repair in a high
density card/board application.  The design has been directed at
signal pins only in follow-on systems with pin densities equal to or
greater than those found on IBM 3090* systems.

      This repair procedure involves overlapping two wire components
within an insulator sleeve (Fig. A) to form an initial metallic bond
between the wires (see Fig. A).  The insulator's internal diameter is
predetermined to set up an interference between the two components.
By using conductive epoxy, the overlapped joint is not only locked
and sealed into place physically, but the conductive nature of the
epoxy also acts as an electrical bond between the two wire parts,
eliminating the need for a solder or welded bond.  The result is a
neat, compact finished component (see Fig. B).
*  Trademark of IBM Corp.