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Disappearing Solder Collector for Solder Bridging Prevention

IP.com Disclosure Number: IPCOM000107910D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Potsko, DS: AUTHOR [+3]

Abstract

Solder bridging formed during wave soldering (Fig. 1) can be eliminated by using a thin layer of Cu as a solder collector. Today's solder collectors, along with the solder they accumulate, remain as permanent features on a board/card. By patterning a thin layer of Cu as the collector, not only is the effect of the collector achieved, the collector dissolves into the eutectic solder it has accumulated and falls free from the card. A thin Cu layer (1-2 microns) can either be sputtered or plated over the surface of the card, and patterned with a photo-etch process (Fig. 2). As the card passes through the wave solder, surface tension causes solder to pull away from the land pattern onto the collector eliminating bridging.

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Disappearing Solder Collector for Solder Bridging Prevention

      Solder bridging formed during wave soldering (Fig. 1) can be
eliminated by using a thin layer of Cu as a solder collector.
Today's solder collectors, along with the solder they accumulate,
remain as permanent features on a board/card.  By patterning a thin
layer of Cu as the collector, not only is the effect of the collector
achieved, the collector dissolves into the eutectic solder it has
accumulated and falls free from the card.  A thin Cu layer (1-2
microns) can either be sputtered or plated over the surface of the
card, and patterned with a photo-etch process (Fig. 2).  As the card
passes through the wave solder, surface tension causes solder to pull
away from the land pattern onto the collector eliminating bridging.
As the card exits the wave, the thin Cu continues to dissolve into
the eutectic, and when completely dissolved, will fall completely off
the surface.

      Disclosed anonymously.