Browse Prior Art Database

Flip Chip Socket for Test/ Burn-in

IP.com Disclosure Number: IPCOM000107912D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 58K

Publishing Venue

IBM

Related People

DuBois, D: AUTHOR [+3]

Abstract

There are numerous techniques for applied stress testing of semi-conductor devices. These techniques generally require a relatively permanent connection of devices to a carrier.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 89% of the total text.

Flip Chip Socket for Test/ Burn-in

      There are numerous techniques for applied stress testing of
semi-conductor devices.  These techniques generally require a
relatively permanent connection of devices to a carrier.

      Disclosed is a method for temporarily contacting semiconductor
chips during a chip burn-in and test process. This process requires
electrical contact of chip input/output and power pads as well as the
application and sensing of heat.

      The disclosed Flip Chip Socket (FCS) is shown in Fig. 1.  It
achieves the required objectives by means of a compliant probe
assembly (1) with high temperature dielectric dies.  The probe
assembly is attached to a multilayer "space transformer" substrate
(2) that changes the fine pitch of the pads to a larger pitch pin
matrix.  It is aligned and secured to the space transformer which
provides electrical fan-out to the burn-in fixture.

      Attached to the probe is a chip alignment Device Under Test
(DUT) die (3) which contacts the chip (4).  The DUT die provides the
necessary alignment for chip insertion.  It consists of a high
temperature dielectric material that has a cavity to align the
periphery of the chip and a hole pattern that matches the footprint
of the chip's electrical contact pads.  In the case where chip pads
are formed with solder bumps, these holes provide alignment of the
contacts (5) to the solder bumps.

      Over the DUT die is a heater/sensor assembly (6) which prov...