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A High Resolution RIE Composite Mask

IP.com Disclosure Number: IPCOM000107913D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 38K

Publishing Venue

IBM

Related People

Kin, CC: AUTHOR [+3]

Abstract

Disclosed are two processes for making a high aspect ratio, composite, thick-film screening mask. These processes provide the capability to produce small features on a thick metal foil with dimensional integrity across the entire surface.

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A High Resolution RIE Composite Mask

      Disclosed are two processes for making a high aspect ratio,
composite, thick-film screening mask.  These processes provide the
capability to produce small features on a thick metal foil with
dimensional integrity across the entire surface.

      In the first process a layer of RIE (Reactive Ion Etching)
resist material X, such as nickel or copper, is deposited on the
thick metal foil, such as a molybdenum foil.  This can be done by
using metal deposition techniques, such as sputtering, plating or
CVD.  The deposition can be done on one or both sides of the
molybdenum foil.  Using either a wet etch technique or a dry film
lift-off technique, the RIE resist material X is patterned, as shown
in Figure 1.

      Thickness and pattern resolution of material X, is limited by
wet etch/dry film lift-off plating process and product
specifications.  The molybdenum foil is then etched, such as by using
an RIE technique to form X-Mo-X composite mask, as shown in Figure 2.

      In the second process, the molybdenum mask can be further
hardened by coating with thin films, such as carbon, nitride, etc.,
if desired.

      Disclosed anonymously.