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Laser Ablation for Pin Repair

IP.com Disclosure Number: IPCOM000107928D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Sloves, E: AUTHOR [+2]

Abstract

Disclosed is a process to cut polymer (BPDA) material around the outer shank of a substrate pin. This process is required so the pin can be removed from the substrate without damage to the surrounding area of polymer material. If a pin is damaged and cannot be repaired, it must be removed. The polymer covering over the shank of the pin must be removed smoothly without exposing the outer copper ring to atmosphere and contamination.

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Laser Ablation for Pin Repair

      Disclosed is a process to cut polymer (BPDA) material around
the outer shank of a substrate pin.  This process is required so the
pin can be removed from the substrate without damage to the
surrounding area of polymer material.  If a pin is damaged and cannot
be repaired, it must be removed.  The polymer covering over the shank
of the pin must be removed smoothly without exposing the outer copper
ring to atmosphere and contamination.

      The process involves using a pulsed Excimer LASER used in
manufacturing today and performing the circular ablation so that the
pin can be removed.  An Anorad servo table is programmed to move in a
circle consisting of 360 points at a fixed velocity while the laser
pulses continuously until the circle is complete.  The energy
threshold of the laser is set to cut the polymer but does not damage
the metallurgy below which was a requirement of the process.  The
width of the anular cut is very small compared to the diameter of the
circular ablation required; thus, the need to develop a clean,
efficient process using existing tooling had to be developed.

      Disclosed anonymously.