Browse Prior Art Database

Method for Removing and Replacing Individual Chips

IP.com Disclosure Number: IPCOM000108033D
Original Publication Date: 1992-Mar-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 59K

Publishing Venue

IBM

Related People

Yakubowski, C: AUTHOR

Abstract

Described is a methodology for removing a defective chip from a multichip substrate and joining a good chip in its place. Refer to Figure.

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Method for Removing and Replacing Individual Chips

      Described is a methodology for removing a defective chip from a
multichip substrate and joining a good chip in its place. Refer to
Figure.

      The substrate with defective chip(s) is placed on a moveable
platform while supported at its bottom and peripheral surface without
resting on its pins.  It is then moved into the work chamber.  This
chamber is a convective reflow oven with a microprocess-based profile
management system suitable for bias heating.  The reflow oven
utilizes fast response long wave radiation, forced gas convection and
conduction.  A frame extends from sides of the chamber, above the
substrate, and is moveable in the X-X axis.  A cover over the frame
is slideable in Y-Y.  Both axes are moved, independent of each other,
via a differential micrometer.  The cover has an array of ports with
removeable plugs that allows access to any one of four chip from a
larger chip array.  To access a specific chip, the port to which that
chip belongs is unplugged.  The cover is moved in X and Y until the
chip is approximately in the center of its assigned port.  Special
function probes have been designed to be placed into unplugged ports
to carry out specific operations.

      This tool, with its probes, when used in a prescribed sequence,
can remove defective chips, site redress flux, align good chips,
place, and reflow one chip at a time within a controlled environment.
The operating mode...