Browse Prior Art Database

Method of Bonding Tape Automated Bonding Packages using Conventional Surface Mount Technologies

IP.com Disclosure Number: IPCOM000108043D
Original Publication Date: 1992-Apr-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 3 page(s) / 130K

Publishing Venue

IBM

Related People

Cipolla, TM: AUTHOR [+3]

Abstract

Disclosed is a device and technique that allows Tape Automated Bonding (TAB) packages to be bonded to substrates using conventional surface mount manufacturing methods. The technique also works for attaching flex circuitry to substrates, such as FR4 cards.

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This is the abbreviated version, containing approximately 52% of the total text.

Method of Bonding Tape Automated Bonding Packages using Conventional Surface Mount Technologies

       Disclosed is a device and technique that allows Tape
Automated Bonding (TAB) packages to be bonded to substrates using
conventional surface mount manufacturing methods.  The technique also
works for attaching flex circuitry to substrates, such as FR4 cards.

      The basic invention described here is shown in Figs. 1 and 2.
Fig. 1 shows a TAB package with four holes in each of the corners and
a low-cost, one-piece, injection-molded fixture made of a material
that is suitable to withstand solder reflow temperatures.  The
fixture has several pin-like protrusions that match the hole
locations on the TAB package.  The holes are etched in the copper
and/or dielectric of the package at the same time that the circuitry
is etched, thus adding no cost to the package. The molded pins in the
fixture are pressed into the holes in the package, thus forming a
single temporary assembly not unlike conventional surface mount
packages.  This assembly is shown in Fig. 2.  The fixture has
protruding from the corners a set of feet that allow the temporary
structure to stand on a circuit card with the TAB outer leads at the
proper height relationship to the bonding pads on the card. The feet
are shaped in a way that allows protection of the leads while they
are in a carrier but at the same time allows them to be viewed from
above by the fixture as with conventional surface mount pick and
place tools and be placed in solder paste.  The fixture gives the
temporary structure stiffness and weight properties not too different
from conventional surface mount packages and thus allows this package
to be processed in the same manner.

      Fig. 3 shows a variation of the fixture described above.  For
clarity, the protruding feet have been eliminated, but it should be
understo...