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Sublimation Printing Process for Component Identification Marking

IP.com Disclosure Number: IPCOM000108133D
Original Publication Date: 1992-Apr-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 55K

Publishing Venue

IBM

Related People

Griffith, AJ: AUTHOR [+4]

Abstract

Component identification and descriptions are currently applied to the solder mask layer on the surfaces of printed circuit boards. The materials used for this process are generally simple mixtures of resins and pigments. The materials may be cured either thermally or by ultraviolet radiation. Because these materials are applied to the smooth surface of the cured solder mask they exhibit poor adhesion. This poor adhesion is the cause of the loss of the material during assembly handling. Often the damage is severe enough render the identification unreadable. This causes problems during assembly, rework and field repair activities. Another drawback of the materials used is that they require labor-intensive activities for their application.

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Sublimation Printing Process for Component Identification Marking

       Component identification and descriptions are currently
applied to the solder mask layer on the surfaces of printed circuit
boards.  The materials used for this process are generally simple
mixtures of resins and pigments.  The materials may be cured either
thermally or by ultraviolet radiation.  Because these materials are
applied to the smooth surface of the cured solder mask they exhibit
poor adhesion.  This poor adhesion is the cause of the loss of the
material during assembly handling.  Often the damage is severe enough
render the identification unreadable.  This causes problems during
assembly, rework and field repair activities.  Another drawback of
the materials used is that they require labor-intensive activities
for their application.

      An improved process is provided by the use of sublimation
printing to apply the component identification and location markings
to the solder mask layer.  This process is based on a dry heat
transfer technique. Component identification and location markings
are printed onto a release paper surface using the sublimation inks.
When the release paper is put in contact with the solder mask surface
(ink down) and heated, the ink sublimes and permeates the solder mask
as a gas.  It then condenses to leave a perfect replica of the
printed image.  The image has excellent clarity, resists bleeding and
is permanent in that it becomes imbedded in t...