Browse Prior Art Database

Close Packed Chip Cooling Device

IP.com Disclosure Number: IPCOM000108162D
Original Publication Date: 1992-Apr-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 50K

Publishing Venue

IBM

Related People

Kok, P: AUTHOR [+2]

Abstract

Disclosed is a design for an integrated cold plate and heat sink that will provide effective cooling for high density arrays of chips or chip carriers. The design consists of heat sinks with fins, and a cold plate with slots that intercalate with the heat sink fins. This design is described here for heat sinks with two fins, but can obviously be designed with different numbers of fins depending on chip size and other engineering parameters.

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Close Packed Chip Cooling Device

      Disclosed is a design for an integrated cold plate and heat
sink that will provide effective cooling for high density arrays of
chips or chip carriers.  The design consists of heat sinks with fins,
and a cold plate with slots that intercalate with the heat sink fins.
This design is described here for heat sinks with two fins, but can
obviously be designed with different numbers of fins depending on
chip size and other engineering parameters.

      FIG. 1, a cross section of the cold plate and heat sinks, shows
how inserts can be designed to close pack and still leave room for a
water channel in between each pair of fins.  Sufficient clearance and
chamfers can be added to accommodate chip tilt in the direction
across the fins.  In the other direction, chip tilt can be
accommodated by rounding the ends of the heat sinks, as shown in FIG.
2, while still allowing contact between the heat sinks. Springs would
be placed between the heat sink and cold plate to keep the heat sinks
in contact with the chips or chip carriers.

      With this design, essentially "brick walled" cooling can be
achieved while still accommodating the different heights and chip
tilts inherent in a multichip module.

      Disclosed anonymously.