Browse Prior Art Database

Flexible Tubular Cooling Module

IP.com Disclosure Number: IPCOM000108164D
Original Publication Date: 1992-Apr-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 48K

Publishing Venue

IBM

Related People

Behum, JR: AUTHOR

Abstract

A thin sheet of thermally conductive material (1) is attached to the inside of a cap (2) of an electronic package. Attachment may be by means of clamping action or an adhesive (3). The thin sheet may be formed as a tube prior to insertion into the electronic package, or may be sealed as a tube by clamping action as shown below.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 90% of the total text.

Flexible Tubular Cooling Module

      A thin sheet of thermally conductive material (1) is attached
to the inside of a cap (2) of an electronic package.  Attachment may
be by means of clamping action or an adhesive (3).  The thin sheet
may be formed as a tube prior to insertion into the electronic
package, or may be sealed as a tube by clamping action as shown
below.

      Cooling of the semiconductor device (4) attached to the
substrate (5) is accomplished by energy transfer from the chip,
through the thin sheet material, and into the forced convective
matter flowing inside (6).  This flowing matter may be in a liquid
form (eg. water, fluorocarbon) or in a gaseous form (eg.  air,
helium).

      To improve upon the thermal transfer characteristics of the
sheet to the flowing matter, the inside of the sheet may be lined
with cooling fins to increase the surface area of contact between the
moving matter and the sheet material (7).  The inside of the sheet
material may also be treated so as to aid in the formation of
nucleated boiling points should this method of heat transfer be
desired.

      An electronic package could consist of a number of rows of
cooling tubes.  Advantages of this method include: low restrictive
heat transfer due to the low resistance of the tube and nearness of
the forced convention heat transfer matter; effect of chip tilt is
insignificant as the flexible tube will contact 100% of the backside
of the chip independent of normall...