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Lift off Masks for Multilayer Dielectric Coatings

IP.com Disclosure Number: IPCOM000108178D
Original Publication Date: 1992-Apr-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Doany, F: AUTHOR [+3]

Abstract

Disclosed is a method of preparing multilayer dielectric masks for laser etching by using a lift off technique.

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This is the abbreviated version, containing approximately 100% of the total text.

Lift off Masks for Multilayer Dielectric Coatings

      Disclosed is a method of preparing multilayer dielectric masks
for laser etching by using a lift off technique.

      Figure 1 shows a cross section of a fused quartz substrate 1
with a layer of polymer 2 (which would probably be a polyimide to
give high temperature stability), which has been patterned with holes
and lines 3 by normal lithographic and etching means, or by laser
ablation from the top.

      If now a laser is used to further ablate this pattern, but the
laser light 4 impinges in the film through the substrate 1, as shown
in figure 2, the material will be formed with an undercut edge 5.  In
this case, deposition of the various layers of the multilayer coating
6 from the top will leave the side walls 5 of the holes and lines
3 free of material as sketched in figure 3.  The polymer can than be
etched away, carrying portions of the multilayer dielectric film with
it, and the substrate will be left with a patterned dielectric film.

      Disclosed anonymously.