Browse Prior Art Database

Flexible Applique Attachment for Surface Mounted Technology Small Outline Integrated Circuit

IP.com Disclosure Number: IPCOM000108195D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Robertson, SE: AUTHOR [+2]

Abstract

The primary component carrier or printed circuit board for surface mounted technology (SMT) can be modified by adding a thin printed circuit board, approximately one-tenth the thickness of the primary carrier, adjacent to it. On the thin carrier, an alternate circuit is provided to fix an existing problem or modify the function of the primary assembly.

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This is the abbreviated version, containing approximately 100% of the total text.

Flexible Applique Attachment for Surface Mounted Technology Small Outline Integrated Circuit

       The primary component carrier or printed circuit board
for surface mounted technology (SMT) can be modified by adding a thin
printed circuit board, approximately one-tenth the thickness of the
primary carrier, adjacent to it.  On the thin carrier, an alternate
circuit is provided to fix an existing problem or modify the function
of the primary assembly.

      In many cases, it is desirable to make connection to surface
mounted small outline integrated circuit (SOIC) components.  Fig. 1
shows the footprint of the connection, with a plated hole 1 and pad 2
overlapping the "gull-wing" SOIC lead 3.  The cut-out 4 in the thin
carrier may be made to align with the leads of the SOIC.

      Fig. 2 shows the profile of the solder secured connection.  The
thin circuit boards 1 are adjacent to the primary carrier 2, with the
solder 3 making a mechanically and electrically strong connection to
the SOIC lead.

      This splice provides a reliable, repeatable way to make
connection to SOICs in order to fix or modify the function of the
primary assembly.