Browse Prior Art Database

High Density Feature and Memory Card Packaging

IP.com Disclosure Number: IPCOM000108289D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 7 page(s) / 192K

Publishing Venue

IBM

Related People

Johnson, WC: AUTHOR [+2]

Abstract

This article identifies a method of obtaining extremely high density packaging electronics packaging in a minimum volume.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

High Density Feature and Memory Card Packaging

       This article identifies a method of obtaining extremely
high density packaging electronics packaging in a minimum volume.

      The disclosed idea allows for maximum flexibility of packaging,
while enhancing cooling capability and allowing modular construction.
The package can be self-contained with its own cooling packages.
External interfaces would be power and connections to external
devices.  The entire package can be contained within the confines of
the external structure.

      Fig. 1 shows a configuration which includes 26 option/CPU
cards.  The package is configured to match any of the PS/2* or larger
cards (which includes a CPU card the size of the Model 320 IBM
RISC/System 6000*).  This figure contains only feature cards as shown
but could be modified, as shown in Figs. 1A and 1B, to contain memory
and other cards.  The cards are placed at an angle in certain
locations to provide more space or to provide more card space.  Each
card (except the memory) is on MICRO CHANNEL* spacing.

      Fig. 1A shows the flexibility of mounting as many as 8
hardfiles and 8 memory cards and as many as 14 option/CPU cards.

      Fig. 1B shows memory cards with CIMMS installed at two
different angles.  This is to show the flexibility of the idea.  Fig.
1C shows the package with all cards at an angle.

      Fig. 2 shows a side view of the package with its own cooling
fan and plenum chamber for the air.  This shows only one fan, while
Fig. 3 shows a four-fan configuration with a plenum chamber also.
Fig. 4 shows an idea for a card support for the package scheme.  This
allows two of the same configuration card supports to be used, i.e.,
one part number used twice.

      The concept here is to have the pack...