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Flexible Applique Attachment for SMT Resistors and Capacitors

IP.com Disclosure Number: IPCOM000108291D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Robertson, SE: AUTHOR [+2]

Abstract

The primary component carrier or printed circuit board for surface mounted technology (SMT) can be modified by adding a thin printed circuit board, approximately one-tenth the thickness of the primary carrier, adjacent to it. On the thin carrier, an alternate circuit is provided to fix an existing problem or modify the function of the primary assembly.

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This is the abbreviated version, containing approximately 100% of the total text.

Flexible Applique Attachment for SMT Resistors and Capacitors

       The primary component carrier or printed circuit board
for surface mounted technology (SMT) can be modified by adding a thin
printed circuit board, approximately one-tenth the thickness of the
primary carrier, adjacent to it.  On the thin carrier, an alternate
circuit is provided to fix an existing problem or modify the function
of the primary assembly.

      In many cases, it is desirable to make connection to surface
mounted chip capacitors and resistors.  Fig. 1 shows the footprint of
the connection with a plated through hole 1 and connections pad 2.

      Fig. 2 shows the solder profile after the connection has been
secured.  The thin circuit board 1 is adjacent to the primary
assembly 2, and butted against the chip component 3, so that solder 4
makes a mechanically and electrically strong connection to the
oversized component pad 5 on the primary carrier.  This splice
provides a reliable, repeatable way to make connection to chip
components in order to fix or modify the function of the primary
assembly.