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Interconnection of Fine Pitch Components via Patterned Anisotropic Conducting Film

IP.com Disclosure Number: IPCOM000108312D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Massey, DE: AUTHOR [+2]

Abstract

Fine pitch components can be attached to substrates, cards, panels, etc., by the use of Patterned Anisotropic Conductive Films (PACFs) and film adhesive. Direct chip attach can also be accomplished in this manner.

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Interconnection of Fine Pitch Components via Patterned Anisotropic Conducting Film

       Fine pitch components can be attached to substrates,
cards, panels, etc., by the use of Patterned Anisotropic Conductive
Films (PACFs) and film adhesive.  Direct chip attach can also be
accomplished in this manner.

      In order to achieve this, PACFs, like the one shown in Fig. 1,
are used.  There are many possible processes which can produce a
PACF.  For illustration purposes, the PACF depicted in Fig. 1
contains 25x25x15- micron conductive columns, separated by 25-micron
polymer dielectric.

      Fig. 2 shows the use of a PACF in a direct chip attach
application.  The final assembly consists of an adhesive cover film,
the chip, the PACF and the substrate.