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Collapsible Bonding Structure for Engineering Change and Personalized Connections

IP.com Disclosure Number: IPCOM000108315D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 3 page(s) / 107K

Publishing Venue

IBM

Related People

Brofman, PJ: AUTHOR [+5]

Abstract

A method to create vertical personalizable connection points that improve design, tooling and process tolerances for Engineering Change (EC) and repair schemes is described. The system has the following key features: . Vertical collapsible structure for electrical interconnection of structures on different planes. . Flexibility of interconnection: supports mechanical and/or directed energy methods of making connection. . Structure reduces tolerances required for interconnection scheme (since a connection is made at a single point rather than bridging across two points.) . Connection permits use of cross-over grid with "programmable" net generation.

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This is the abbreviated version, containing approximately 52% of the total text.

Collapsible Bonding Structure for Engineering Change and Personalized Connections

       A method to create vertical personalizable connection
points that improve design, tooling and process tolerances for
Engineering Change (EC) and repair schemes is described. The system
has the following key features:
  .  Vertical collapsible structure for electrical interconnection of
structures on different planes.
  .  Flexibility of interconnection: supports mechanical and/or
directed energy methods of making connection.
  .  Structure reduces tolerances required for interconnection scheme
(since a connection is made at a single point rather than bridging
across two points.)
  .  Connection permits use of cross-over grid with "programmable"
net generation.

      A specialized vertical link structure is described that
facilitates the EC connections on high performance packaging modules.
The new structure relaxes the tolerances required in the tools and
supports both contact and non-contact methods of forming the
connection.

      The structure consists of a specially designed and built
vertical contact.  Fig. 1 shows a schematic of the contact.

      The electrical connection is made by deforming, either
mechanically (e.g., ultrasonic piston load, thermocompression, etc.)
or with directed/localized energy (laser, E-beam, ion beam etc.), the
top surface metallurgy such that it makes contact with the lower pad.
The deformation is sufficient to produce a stable joint, either
through the plastic flow created through mechanical deformation or
through melting and resolidification of the structure during
localized heating.  The overhang region shown in the cross-section is
collapsed, forming the desired vertical connection.  The ratio of the
metal and dielectric thickness...