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Vacuum Follower Pre-clean Module for Si and SiGe Epitaxial Process

IP.com Disclosure Number: IPCOM000108336D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 3 page(s) / 97K

Publishing Venue

IBM

Related People

Chu, JO: AUTHOR [+2]

Abstract

A blow/vacuum cleaning process attached to an angle adjustable spinning pre-clean tool for preparing defect and/or particle-free patterned Si wafer prior to the Si and SiGe epitaxial layer growth is described.

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This is the abbreviated version, containing approximately 52% of the total text.

Vacuum Follower Pre-clean Module for Si and SiGe Epitaxial Process

       A blow/vacuum cleaning process attached to an angle
adjustable spinning pre-clean tool for preparing defect and/or
particle-free patterned Si wafer prior to the Si and SiGe epitaxial
layer growth is described.

      This invention, Vacuum Follower Pre-clean Module (VFPM), is
concerned with a new cleaning concept for a tool to prepare defect
and/or particle-free Si patterned wafer prior to Si or SiGe epitaxial
growth.

      Pre-clean of patterned Si wafers has been one of the major
obstacles for the development of Si and SiGe epi layers toward a
manufacturable process.  However, as ion implantation technique
starts to approach its limit in controlling defect-free thin doped
layer (& 500  Ao) with desirable doping profile, epitaxial growth
process becomes more and more demanded for the further scaling down
of Si devices.  Therefore, a pre-clean tool with manufacturable
capability is essential for the future Si technology.

      Currently, the most widely used pre-clean methods for Si wafers
include chemical etch with vapor HF or etch with buffer HF and blow/
spin dry.  These techniques all resulted in a particle and/or defect
density which is not acceptable for device manufacturing.  In
addition, they are not developed to fit in the manufacturing
environment.  A new approach, which is to overcome these drawbacks,
is proposed.

      VFPM consists of three major components.  The first is the
sample holder.  As shown in Fig. 1, the sample holder has a diameter
larger than that of the wafer and has many circular seams that are
used to pump dow...