Browse Prior Art Database

Submerged Heatsink Component Cooling

IP.com Disclosure Number: IPCOM000108365D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 68K

Publishing Venue

IBM

Related People

Johnson, WC: AUTHOR [+3]

Abstract

Disclosed is a design for selective component cooling of high heat density modules/components without major technology changes to the component and mounting technology.

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Submerged Heatsink Component Cooling

       Disclosed is a design for selective component cooling of
high heat density modules/components without major technology changes
to the component and mounting technology.

      A staggered pin array heat sink is mounted to the component
surface.  Surrounding the heat sink is a sealed enclosure with inlet
and outlet fluid connections as shown in Fig. 1.  Fluid is pumped
through the enclosure at a rate necessary to remove the heat
generated by the component which is conducted through the base of the
heat sink into the pins.  The pins of the heat sink reach almost to
the surface of the enclosure so that the fluid is forced to go
between the pins, rather than over them.  The size of the heat
sink/enclosure and the rate of fluid flow would be determined by the
application.  Fig. 2 is an inverted end view.

      Modular units of this type could be joined together with a
tubing system in series, parallel, or series-parallel combinations to
cool multiple components in an application. This approach allows the
pump to be sized for overall system needs while specifying the
individual heat sinks to meet the needs of each component.

      The combination of a pin array heat sink and liquid cooling
provides the capability to cool large heat fluxes easily.