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Browse Prior Art Database

Total EMC Enclosure

IP.com Disclosure Number: IPCOM000108393D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Parks, HM: AUTHOR

Abstract

In recent development and released computer products, electromagnetic interference containment has been one of the major problem areas. Processor speed, component densities, and clock speeds are increasing at a very fast pace; better methods will be necessary for these product to meet the FCC requirements for emissions.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 96% of the total text.

Total EMC Enclosure

       In recent development and released computer products,
electromagnetic interference containment has been one of the major
problem areas.  Processor speed, component densities, and clock
speeds are increasing at a very fast pace; better methods will be
necessary for these product to meet the FCC requirements for
emissions.

      This article offers a method to achieve total EMC containment
that is more economical, less sensitive to assembly variance, and yet
workable as to access to the unit.  Fig. 1 shows a typical square
tube frame with U-shaped channels at the corners and across the
bottom.  The frame is then enclosed by screen wire, copper or
aluminum, similar to household window screening.

      Full electrical contact is maintained on a continuous basis by
the foam-covered rod around the perimeter of the access sides (Fig.
2).  The edges of the screen are folded over the foam/rod and
secured.  This detail is inserted into the U-channels to achieve
continuous contact.

      The unique parts of this disclosure are:  (A)  Using a wire
mesh as a total EMI enclosure.  (B)  The foam-covered rod to seal the
access areas.  (C)  The flexibility of wire mesh to allow air flow in
obtaining thermal control.  (D) Outside covering would be mostly
appearance in nature, so several materials could be utilized since
they would not be dependent upon EMC characteristics.  The outer
covering would not require close fits, finger sto...