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Solder Ball Connection Module Inspection Template

IP.com Disclosure Number: IPCOM000108395D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 74K

Publishing Venue

IBM

Related People

Prime, R: AUTHOR [+2]

Abstract

This article describes a solder ball connection (SBC) module inspection template. The SMT-MLC module (Fig. 1) has area array solder ball terminal connections which are attached to ceramic with eutectic solder. If radial error exceeds the specified value, a degraded solder joint or an open/bridge will be formed. This method provides the means to sort out modules with excessive ball radial error.

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Solder Ball Connection Module Inspection Template

       This article describes a solder ball connection (SBC)
module inspection template.  The SMT-MLC module (Fig. 1) has area
array solder ball terminal connections which are attached to ceramic
with eutectic solder.  If radial error exceeds the specified value, a
degraded solder joint or an open/bridge will be formed.  This method
provides the means to sort out modules with excessive ball radial
error.

      This method uses a gauge plate (Fig. 2) which has a matrix of
cylinders with dimensions precisely to include ball diameter and its
tolerance.  This plate serves as a Go/No-Go gauge to accept or reject
the module so that only the good modules will be used for assembly.