Browse Prior Art Database

3D Multi-layered Package with Heat Sink

IP.com Disclosure Number: IPCOM000108422D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 1 page(s) / 48K

Publishing Venue

IBM

Related People

Bross, A: AUTHOR [+3]

Abstract

Disclosed is a way of coupling a chip surface to an integrated heat sink, in a multi-layered package. The chip is not rigidly attached to the heat sink, but is spring loaded. Thus, the chip is in contact with the heat sink, but it can move and absorb shock, without losing its ability to dissipate heat through the heat sink surfaces.

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3D Multi-layered Package with Heat Sink

      Disclosed is a way of coupling a chip surface to an integrated
heat sink, in a multi-layered package.  The chip is not rigidly
attached to the heat sink, but is spring loaded.  Thus, the chip is
in contact with the heat sink, but it can move and absorb shock,
without losing its ability to dissipate heat through the heat sink
surfaces.

      The chips, are independently, spring, or beam conductor loaded
against a low friction surface of the heat sink, such as a metallic
nitride surface.  The chip is free to move, creating less concern for
CTE differences, thereby enhancing fatigue life of the product.  This
technique is independent of each device.  It can be enhanced with
various means of cooling including air, gas, or liquid.  As CTE
differences are accommodated via a slip plane, greater choice of heat
sink materials based on maximum thermal conductivity is possible.

      The 3D multi-layered package with heat sink comprises an
independent insulative spring 1, assisting a load on circuit beams 2,
against the chips 3, to make chip surface match that of a low
friction thermal grease or metallic slip surface 4, of a heat sink 5.
Insulative layers 6, circuits 7, and I/Os 8, are typical elements of
a multilayered product.

      Depending on the design requirements this technique can be used
in products, such as, substrates, circuit cards, sockets, connectors,
etc.

      Disclosed anonymously.