Browse Prior Art Database

Optimized Tab Chip Mounting with Thermal Improvement

IP.com Disclosure Number: IPCOM000108508D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Matienzo, LJ: AUTHOR [+2]

Abstract

A means to remove heat from a silicon chip based on the concept of a microcapillary thermal interface that maintains temperatures below 120oC is described in (1). The module described in this patent includes a thin layer of oil between a silicon chip and an extruded aluminum cap with a large radius of curvature.

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Optimized Tab Chip Mounting with Thermal Improvement

       A means to remove heat from a silicon chip based on the
concept of a microcapillary thermal interface that maintains
temperatures below 120oC is described in (1).  The module described
in this patent includes a thin layer of oil between a silicon chip
and an extruded aluminum cap with a large radius of curvature.

      An improved performance for heat transfer using the thin oil
layer is disclosed in this article.  The improvements are based on
the following:
1.   Adequate wetting of both surfaces is achieved by deposition of
an oil-compatible chemically attached hydrophobic layer on both
surfaces prior to module capping.
2.   An enhancement in microroughness on the aluminum surface to
reduce air entrapment and better oil coverage.
3.   Reliable methods to produce pores of specific morphology and
dimensions on the alumnium cap in a reproducible manner.

      Adequate wetting of both surfaces is attained by surface
modification with alkoxysilanes that contain hydrocarbon tails by
methods previously described (2,3). Spreading of a liquid is improved
by surface roughness as shown for various pairs of liquid and
substrate (4). Anodization methods for aluminum alloys used in the
aircraft industry develop specific and reproducible morphologies that
have been well characterized (5,6).  These methods of surface
modification produce surface roughness levels below those described
by (7) (ca. 30000 Ao)...