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Paddle Plating Rack

IP.com Disclosure Number: IPCOM000108576D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Poweleit, HR: AUTHOR [+2]

Abstract

Referring to the figures, by using the paddle plating method the chemicals in the plating tank are agitated by the high-speed paddle 12 (Fig. 2) movement, located 4 mm above the substrate surface. The rack is in a vertical position in the plating tank. The substrate 2 is placed into the nest of the base plate 1 and secured by vacuum 10 which is pulled through the vacuum rod 7. The gasket 11 is providing the seal under the substrate. The thief assembly 3 with the four substrate contacts 9 and thief contact 8 is snapped 4 on to the base plate 1. Electrical contact for substrate 9 and thief 8 is made through the electrical rod 6, which is connected to bar holder 5.

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Paddle Plating Rack

       Referring to the figures, by using the paddle plating
method the chemicals in the plating tank are agitated by the
high-speed paddle 12 (Fig. 2) movement, located 4 mm above the
substrate surface.  The rack is in a vertical position in the plating
tank.  The substrate 2 is placed into the nest of the base plate 1
and secured by vacuum 10 which is pulled through the vacuum rod 7.
The gasket 11 is providing the seal under the substrate.  The thief
assembly 3 with the four substrate contacts 9 and thief contact 8 is
snapped 4 on to the base plate 1.  Electrical contact for substrate 9
and thief 8 is made through the electrical rod 6, which is connected
to bar holder 5.