Browse Prior Art Database

Coactive Multilayer Substrates

IP.com Disclosure Number: IPCOM000108675D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Bross, A: AUTHOR [+3]

Abstract

Disclosed is a coactive or enveloped shielding for a circuit in its path through a multilayer substrate. It utilizes an insulated pin or via installed in an insulated metal layer. The via is connected to a circuit conductor that is surround shielded; the surround shield is connected to the insulated metal layer, with multilayers commoned by shared ground pins.

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Coactive Multilayer Substrates

       Disclosed is a coactive or enveloped shielding for a
circuit in its path through a multilayer substrate.  It utilizes an
insulated pin or via installed in an insulated metal layer. The via
is connected to a circuit conductor that is surround shielded; the
surround shield is connected to the insulated metal layer, with
multilayers commoned by shared ground pins.

      The module is made up of layers of insulators, circuits,
surround circuits, insulated vias, and metal or polymer/metal
composites.  Advantages include more closely matched circuits to
module CTE, improved thermal conduction, and forgiving polymer
layers.  The top polymer layer, with lower modulus than a coupled
silicon chip device, can be such that, despite a mismatch of CTEs,
the polymer layer can be forgiving and absorb these differences.

      Accordingly, Fig. 1 shows a top view of a circuit 1 with
surround shielding circuit 2 and insulated via pin 3.

      Fig. 2 is the cross section B-B of Fig. 1, showing the
insulated via 3, with its insulated cover 4, metal layer 6, insulator
bonding film 7, circuit 1, and surround circuit 2, connected to the
inner metal layer 6.

      Fig. 3 shows two layers bonded together with surround circuits
2, interconnecting the metal layers 6, and circuit 1, connected to
the conductor part or the vias.  Thus, by using a surround circuit
connected to inner metal layers, a coactive enveloped shielding is
accomplis...