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Diamond Like Films as a Barrier to Chemical-Mechanical Polish

IP.com Disclosure Number: IPCOM000108738D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-22
Document File: 3 page(s) / 97K

Publishing Venue

IBM

Related People

Cuomo, JJ: AUTHOR [+4]

Abstract

Chemical-mechanical polish is used in the fabrication of semiconductor products due to its greater planarity in the removal of excess material. However, good applications are sometimes hindered by a lack of selectivity between the material to be removed and the patterned material on the substrate. This disclosure shows how this limitation can be overcome by using diamond and diamond-like carbon films as a barrier.

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Diamond Like Films as a Barrier to Chemical-Mechanical Polish

       Chemical-mechanical polish is used in the fabrication of
semiconductor products due to its greater planarity in the removal of
excess material.  However, good applications are sometimes hindered
by a lack of selectivity between the material to be removed and the
patterned material on the substrate.  This disclosure shows how this
limitation can be overcome by using diamond and diamond-like carbon
films as a barrier.

      Certain carbon films, deposited from plasma-assisted CVD or
sputtering, exhibit diamond-like qualities.  They also polish at an
extremely low rate, 4-7 o/min.  In addition, these films can be
patterned with an oxygen plasma or thermal oxidation, and can be
removed in like manner after processing.  They are extremely hard and
totally resistant to wet chemical attack.  They are usually
electrically insulating and optically transparent.

      Many processes can incorporate these films to improve
planarization.  In particular, the use of these diamond-like films in
metal interconnection processes is very advantageous.  A process
sequence using the film to protect the intervening dielectric layer
between levels of metal is given as an example.
1.   Deposit a dielectric material over an existing level of metal
interconnects, polishing or planarizing the high spots, if necessary.
2.   Deposit a thin layer of the diamond-like film (Figure 1).
3.   Pattern the diamond-like film through a masking layer using an
o...