Browse Prior Art Database

Direct Write Process for MLC

IP.com Disclosure Number: IPCOM000108828D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Afzali-Ardakani, A: AUTHOR [+4]

Abstract

For certain applications it is desirable to rapidly produce custom ceramic microelectronic packages. A process was developed which enables this to be done. The process utilizes a direct write method for producing a palladium or chromium/palladium seed layer for electroless plating. The seed layer is deposited directly on a greensheet or on a decal carrier, and then copper is plated up.

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Direct Write Process for MLC

       For certain applications it is desirable to rapidly
produce custom ceramic microelectronic packages.  A process was
developed which enables this to be done.  The process utilizes a
direct write method for producing a palladium or chromium/palladium
seed layer for electroless plating.  The seed layer is deposited
directly on a greensheet or on a decal carrier, and then copper is
plated up.

      The process involves the following steps:  A seed layer of
palladium or chromium/palladium is deposited on a decal carrier which
has had a layer of release material and a layer of soft adhesive
applied to it.  The seed layer is deposited by a direct write method
using Resistive Ribbon Thermal Transfer printing technology.  A print
head such as that disclosed in U.S. Patent 4,800,397 may be used.
Following deposition of the seed layer, copper is plated up using an
electroless plating technique.  Following formation of the copper
conductor pattern on a decal carrier, it can be released onto a
ceramic greensheet and used to build a multilayer ceramic module.
Alternatively, the seed layer could be deposited directly onto a
greensheet and then the copper pattern could be electroplated.  The
greensheet would then be handled as a normal greensheet in the
subsequent MLC processing steps.

      This process enables a manufacturer to form metal conductor
patterns directly from design data without going through either mask
making or pho...