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Fast Repair of Solvent Induced Cracking in Adhered Polyimide Films

IP.com Disclosure Number: IPCOM000108829D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Yang, AC: AUTHOR

Abstract

The solvent-induced defects in the adhered polyimide films can be completely healed at significantly lower temperatures by using a simple and fast method described below.

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Fast Repair of Solvent Induced Cracking in Adhered Polyimide Films

       The solvent-induced defects in the adhered polyimide
films can be completely healed at significantly lower temperatures by
using a simple and fast method described below.

      The method is to apply a thin layer of solvent on the polyimide
surface that contains the defects, followed by drying at a
temperature above the B.P. of the solvent.  Due to the trench-like
structure of the crack-like defects in adhered films (*), the applied
solvent preferentially diffuses into and stays inside the defects,
and dissolves the top layer of the trench walls.  The dissolved
polyimide then fills the defects after the solvent evaporates.  The
healing process can extend to true cracks if the debonding and
separation of the cracks is not too serious.  The healing process can
be fast and complete if a solvent of high solubility and low B.P. is
used.  This method allows the healing to take place at a much lower
temperature compared to that in a dry process in which annealing
above the glass transition temperature of the polyimide is required.

      Reference
(*)  A.C.-M. Yang and H. R. Brown, "Solvent-Induced Local Deformation
Zones in Polyimide Films Adhered to a Rigid Substrate," J. Mat.
Sci., 23, 65 (1988).