Browse Prior Art Database

Laminated Seed Layers for Plated Thin Film Heads and Structures

IP.com Disclosure Number: IPCOM000108843D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 3 page(s) / 110K

Publishing Venue

IBM

Related People

Herman Jr, DA: AUTHOR [+3]

Abstract

A method of producing a high quality soft magnetic material for magnetic recording heads by using a laminated seed layer under the plated layer is disclosed. It is significant because the magnetic properties of the seed layer have a major effect on head performance and providing magnetically superior, reproducible seed layers will enhance head performance.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Laminated Seed Layers for Plated Thin Film Heads and Structures

       A method of producing a high quality soft magnetic
material for magnetic recording heads by using a laminated seed layer
under the plated layer is disclosed.  It is significant because the
magnetic properties of the seed layer have a major effect on head
performance and providing magnetically superior, reproducible seed
layers will enhance head performance.

      A key to obtaining magnetic thin film heads with acceptable
stability and performance seems to be control of the magnetic
properties of the sputtered seed layers (typically, 500 to 1000 Ao
thick) upon which the thicker magnetic layers (typically, > 1 mm) are
plated.  Such a layer is critical to thin film head fabrication as it
provides the surface for plating P1 and P2 permalloy (or other soft
magnetic materials such as CoFeCu) layers.  The magnetic properties
and deposition conditions under which the seed layers are deposited
are generally not considered or at the very least not optimized in
terms of overall head performance.  We teach a method of (1)
providing a well-orientated, low coercivity seed layer and (2)
providing a uniform surface for deposition of this layer on actual
head wafers.

      The use of a laminated seed layer is disclosed for this
application, and maintaining it will provide benefits to head
performance by providing a base layer for plating which has excellent
well-controlled magnetic properties.  A second benefit of the use of
laminated seed layers is that when depositing such a multi-layer
film, the first layer may be non-magnetic, either metallic or
dielectric, which will act as a leveling/sealing layer over hard
baked photoresist and/or gap insulator for P2 deposition.  Thus, a
uniform substr...