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Snap-On Solder Wave Ski

IP.com Disclosure Number: IPCOM000108853D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 46K

Publishing Venue

IBM

Related People

Kroeker, EB: AUTHOR

Abstract

A snap-on ski that prevents printed circuit board (PCB) sag during soldering on the wave solder machine is described and shown in Figure 1. The snap-on ski requires no adjustments if the PCB conveyer or solder pot are moved, is easy to remove for PCBs that do not require a ski, and avoids damage to the solder wave machine in adverse conditions.

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This is the abbreviated version, containing approximately 100% of the total text.

Snap-On Solder Wave Ski

      A snap-on ski that prevents printed circuit board (PCB) sag
during soldering on the wave solder machine is described and shown in
Figure 1.  The snap-on ski requires no adjustments if the PCB
conveyer or solder pot are moved, is easy to remove for PCBs that do
not require a ski, and avoids damage to the solder wave machine in
adverse conditions.

      The ski 15 and its two mounting brackets 14 ride on two support
shafts 5, which are mounted on the conveyer rails 4 & 8 with brackets
3 & 2 and 9 & 10.  Support shafts 5 are free to move in
bushing 7, permitting conveyer 8 with attached mounting brackets 9 &
10 to be adjusted for different width PCBs 6.  Bushing 7 prevents
damage to the solder wave machine by allowing the ski to slide when
the conveyer moves against it.  If build up occurs on support shafts
5, bushing 7 will push out before the solder wave machine is damaged.
Each support shaft 5 has a groove 11 corresponding to the ridge 13 on
the snap-on ski, which keeps the ski in the required position under
PCB 6.  The snap-on feature is accomplished by two thin steel members
12 whose ends bend toward the support shaft 5 to maintain contact.

      Disclosed anonymously.