Browse Prior Art Database

High Strength Silicon Polymer Non-Hermetic Sealing

IP.com Disclosure Number: IPCOM000108862D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 37K

Publishing Venue

IBM

Related People

Francis, JF: AUTHOR [+2]

Abstract

A silicone base polymer can be used for non-hermetic and semihermetic sealing of a cap to a substrate for electronic packaging.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

High Strength Silicon Polymer Non-Hermetic Sealing

      A silicone base polymer can be used for non-hermetic and
semihermetic sealing of a cap to a substrate for electronic
packaging.

      The polymer can replace a solder sealband of gold and a 60/40
tin/lead preform.  Silicone polymers possess chemical stability over
a wide temperature range, excellent dielectric properties, unprimed
adhesion and high tensile strength making them superb as a hermetic
sealing medium.

      A uniform thickness of silicone polymer is applied by a syringe
to either the outer edge of the chip carrying substrate or the cap.
The cap is then placed on the substrate so that the silicone
separates cap and substrate. A uniform pressure to the cap and the
module assembly is cured at a predetermined temperature, thereby
encapsulating the electronic components into a non-hermetic or
semi-hermetic package.  One curing process for silicone polymer
sealing involves an oven at approximately 150o C for 1 hour, with
allowances to accommodate volume expansion of the polymer and prevent
excessive pressure build-up at higher temperatures.

      Disclosed anonymously.