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Adhesion Test for Polymers

IP.com Disclosure Number: IPCOM000108867D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 40K

Publishing Venue

IBM

Related People

Gould, D: AUTHOR [+4]

Abstract

Testing the adhesion of polymers such as epoxies, thermoplastics and polyimides to surfaces such as Si, SiO2, polyimide, FR4, ceramic, metals, etc. is very important in electronics packaging industry. In applications where one polymer is applied in a viscous liquid form onto the solid surface and then cured or hardened, stud pull test has been commonly used for measurement of adhesion.

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Adhesion Test for Polymers

      Testing the adhesion of polymers such as epoxies,
thermoplastics and polyimides to surfaces such as Si, SiO2,
polyimide, FR4, ceramic, metals, etc. is very important in
electronics packaging industry.  In applications where one polymer is
applied in a viscous liquid form onto the solid surface and then
cured or hardened, stud pull test has been commonly used for
measurement of adhesion.

      As shown in Figure 1, the adhesion involves two interfaces,
namely, the substrate to polymer interface and the stud to polymer
interface.  The stud-polymer adhesion needs to be much higher than
the substrate-polymer adhesion for the test to be meaningful.

      A modification to the stud pull test is disclosed.  The design
of a new type of stud is shown in Figure 2.  During the polymer
attachment process, the polymer fills the cavity at the end of the
stud.  This produces a physical interlock joint between the polymer
and the stud which generally has a higher strength than the
substrate-polymer interface adhesion.  When pulled, only the true
adhesion of the substrate-polymer interface is tested.

      Disclosed anonymously.