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Gullwing Device Solderability Rework Process

IP.com Disclosure Number: IPCOM000108878D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

Gullwing devices with lead solderability problems can be reworked by this process without a build-up of solder in the lead bends which reduces finished solder joint reliability and precludes automated device assembly.

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Gullwing Device Solderability Rework Process

      Gullwing devices with lead solderability problems can be
reworked by this process without a build-up of solder in the lead
bends which reduces finished solder joint reliability and precludes
automated device assembly.

      The process description (see Fig. 1) is as follows: Gullwing
Device 1 has fluxed leads inserted in the opening in the polyimide
film 2 and immersed in molten solder 3.  As the Gullwing device leads
are withdrawn through the opening in the polyimide film, excess
solder is removed from the leads.

      Disclosed anonymously.