Browse Prior Art Database

Surface Solder Redress Tool

IP.com Disclosure Number: IPCOM000108879D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Kohn, H: AUTHOR [+3]

Abstract

Disclosed is a device that will remove excess solder from the surface of circuit boards. This tool is unique in that it can remove a relatively wide width of solder in one pass. There is no commercial tool that can do this.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Surface Solder Redress Tool

      Disclosed is a device that will remove excess solder from the
surface of circuit boards.  This tool is unique in that it can remove
a relatively wide width of solder in one pass. There is no commercial
tool that can do this.

      The figure below illustrates the redress tool.  It consists of
a heat resistant handle to which is mounted a heater block.  This
block contains a cartridge heater that conducts heat down to the
nozzle.  When the nozzle is held against a surface soldered pad, the
heat will melt the solder.  A thin rectangular slot in the nozzle is
internally connected to a solder trap with filter.  The solder trap
has a vacuum hose connected to a finger-operated valve that when
depressed will deliver vacuum to the slot in the nozzle. This vacuum
will suck liquid solder into the solder trap. The end of the nozzle
has standoffs at each end to prevent the nozzle from contacting the
surface pads and damaging them as the nozzle is passed over the pads.
The standoffs also allow a thin layer of solder to remain on the
pads, to prepare them for future component attachment.

      Disclosed anonymously.