Browse Prior Art Database

Chip Carrier Substrate Processing Carrying Tray

IP.com Disclosure Number: IPCOM000108880D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Becker, RJ: AUTHOR [+5]

Abstract

Disclosed is a tray for holding chip carrier substrates during and between circuitization processes such as etching, photolithography, and test.

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Chip Carrier Substrate Processing Carrying Tray

      Disclosed is a tray for holding chip carrier substrates during
and between circuitization processes such as etching,
photolithography, and test.

      Refer to Fig. 1.  The tray holds the substrate along its edges
by means of the tines.  To load or unload the substrate the tines are
spread by forces applied by the cams of a load/unload station.  The
substrate is placed into or removed from the carrier by a mechanism
such as the lift shown.  Additionally, the substrates are positioned
into the tray by pushing them along tracks (not shown).  Trays of
various configurations hold substrates in various arrays depending on
process needs.  Two arrays are shown in Fig. 2.

      Disclosed anonymously.