Browse Prior Art Database

Hot Gas Thermode for Electronic Component Removal/Attachment

IP.com Disclosure Number: IPCOM000108904D
Original Publication Date: 1992-Jun-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 57K

Publishing Venue

IBM

Related People

Horton, RR: AUTHOR [+6]

Abstract

A novel thermode/nozzle design is disclosed that can be used for removal/attachment of microelectronic devices (such as chips, chip carriers and other discrete components) from/to packaging carriers (such as modules, printed circuit boards). The joining interconnection between the two parts to be achieved or removed is via a solder reflow process. It consists of a top section that comprises heaters and suitable media to store the heat (high thermal mass material such as a mass of stainless steel spheres). Process gas which can be inert (like argon, helium or nitrogen) or reducing (hydrogen or forming gas) is passed through this heater/exchanger section so that heat can be transferred from the heaters to the storage media and then back to the gas as required.

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This is the abbreviated version, containing approximately 68% of the total text.

Hot Gas Thermode for Electronic Component Removal/Attachment

      A novel thermode/nozzle design is disclosed that can be used
for removal/attachment of microelectronic devices (such as chips,
chip carriers and other discrete components) from/to packaging
carriers (such as modules, printed circuit boards).  The joining
interconnection between the two parts to be achieved or removed is
via a solder reflow process.  It consists of a top section that
comprises heaters and suitable media to store the heat (high thermal
mass material such as a mass of stainless steel spheres).  Process
gas which can be inert (like argon, helium or nitrogen) or reducing
(hydrogen or forming gas) is passed through this heater/exchanger
section so that heat can be transferred from the heaters to the
storage media and then back to the gas as required.  The hot gas is
exited through a lower nozzle section that is shaped to direct and
apply the flow of hot process gas over, under or closely surrounding
the microelectronic device to be attached/removed, at the same time
minimizing the spreading of this gas flow to other components that
may be located on the same substrate.  Thus, the hot gas stream
provides the heat as well as a protective blanket atmosphere that
will allow the oxidationfree melting of the solder connections.  The
design can also be modified to allow additional heat flow by physical
contact with the device and thus facilitating conductive heat flow.
The thermode has a centra...