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Enhanced Thin Film Metal/ Alumina Adhesion by Texturing Films Using Textured Teflon Substrates

IP.com Disclosure Number: IPCOM000108916D
Original Publication Date: 1992-Jul-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 45K

Publishing Venue

IBM

Related People

Chan, C: AUTHOR [+3]

Abstract

Adhesion between metals and polymers and between metals and ceramics has been an important concern for semiconductor device and packaging technologies. Earlier studies on adhesion between Cu and TEFLON, a fluorocarbon polymer, have shown a much enhanced adhesion by texturing the TEFLON using a sputtering treatment prior to the deposition of Cu (*).

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Enhanced Thin Film Metal/ Alumina Adhesion by Texturing Films Using Textured Teflon Substrates

       Adhesion between metals and polymers and between metals
and ceramics has been an important concern for semiconductor device
and packaging technologies.  Earlier studies on adhesion between Cu
and TEFLON, a fluorocarbon polymer, have shown a much enhanced
adhesion by texturing the TEFLON using a sputtering treatment prior
to the deposition of Cu (*).

      A novel technique is described for producing textured surfaces
of thin film ceramic materials in order to achieve enhanced adhesion
with metals.  Al2O3 is used as an example.  A textured thin film of
alumina is obtained by depositing the alumina on a textured TEFLON
substrate.

      Bulk TEFLON was used as substrates.  The TEFLON was textured by
a sputtering treatment using 500 ev Ar+ ions for 120 seconds.  The
TEFLON substrates were then loaded into a reactive sputtering chamber
to deposit alumina films thicknesses of 500, 2000, and 10000
angstroms.  An examination of these films using a scanning electron
microscope showed that the texture of the 500-angstrom-thick alumina
film was very similar to that of the textured TEFLON substrate.  As
the alumina film thickness increased, the surface of the alumina
becomes less textured (i.e., becomes smoother).

      Subsequent deposition of patterned thick Cu strips, 8 microns,
allowed measurement of peel strength using a 90-degree peel tester.
The peel s...