Browse Prior Art Database

High Performance Localized Cooling Cold Plate

IP.com Disclosure Number: IPCOM000109034D
Original Publication Date: 1992-Jul-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Martin, RF: AUTHOR [+5]

Abstract

Disclosed is a means of providing a thermal management solution to geometrically complicated and high-power dissipating electronic devices. This new cold plate concept consists of individual fin inserts (Fig. 1) assembled to a base plate which has drilled holes to provide for water manifolding. The number and the size of fins on each insert may be varied to locally control the cooling performance (Fig. 2). The base plate need not be made of heat-conductive material, as it functions only to provide water passages. Any performance-related design change may be incorporated by replacing a single insert with the rest remaining.

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High Performance Localized Cooling Cold Plate

       Disclosed is a means of providing a thermal management
solution to geometrically complicated and high-power dissipating
electronic devices.  This new cold plate concept consists of
individual fin inserts (Fig. 1) assembled to a base plate which has
drilled holes to provide for water manifolding.  The number and the
size of fins on each insert may be varied to locally control the
cooling performance (Fig.  2).  The base plate need not be made of
heat-conductive material, as it functions only to provide water
passages.  Any performance-related design change may be incorporated
by replacing a single insert with the rest remaining.