Browse Prior Art Database

Network Plating on Seed Layer to Improve Plating Uniformity

IP.com Disclosure Number: IPCOM000109052D
Original Publication Date: 1992-May-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 61K

Publishing Venue

IBM

Related People

Fu, WB: AUTHOR [+4]

Abstract

Disclosed is a method to improve plating uniformity throughout the active device area of a substrate based on pre-plating the inactive area of a substrate to enhance electrical conductivity and current distribution across the substrate. This method is applicable to the electroplating of thin metals for any application utilizing a deposited seed layer, and particularly for magnetic layers of thin film recording heads. Common methods for enhancing uniformity of thickness and composition for magnetic heads optimize seed layer thickness and deflector currents to minimize variations in the integral of current density with the plating cycle time across the substrate. These common methods are increasingly limiting as the substrate size increases and the plated film thickness decreases.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 61% of the total text.

Network Plating on Seed Layer to Improve Plating Uniformity

      Disclosed is a method to improve plating uniformity throughout
the active device area of a substrate based on pre-plating the
inactive area of a substrate to enhance electrical conductivity and
current distribution across the substrate.  This method is applicable
to the electroplating of thin metals for any application utilizing a
deposited seed layer, and particularly for magnetic layers of thin
film recording heads.  Common methods for enhancing uniformity of
thickness and composition for magnetic heads optimize seed layer
thickness and deflector currents to minimize variations in the
integral of current density  with the plating cycle time across the
substrate.  These common methods are increasingly limiting as the
substrate size increases and the plated film thickness decreases.
Use of a pre-plated network in the inactive areas of the substrate
provides a more uniform distribution of electropotential and plating
current leading to film which is more uniform in thickness and
composition.

      In practice, the plated network is prepared before plating the
devices.  The sequence of steps is as follows:
1.   After seed layer deposition and before definition of the active
device area of the substrate, a simple process is used to define
patterns for network plating.
2.   All peripheries of the substrate as well as areas within and
between active devices are electroplated in the same plating b...