Browse Prior Art Database

Heat Transfer Improvement for Thermal Carrier Circuit Cards

IP.com Disclosure Number: IPCOM000109105D
Original Publication Date: 1992-Jul-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Hawthorn, K: AUTHOR

Abstract

Disclosed is a modification to Thermal Carrier Printed Circuit Cards to improve heat transfer from certain Surface Mounted Components

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Heat Transfer Improvement for Thermal Carrier Circuit Cards

       Disclosed is a modification to Thermal Carrier Printed
Circuit Cards to improve heat transfer from certain Surface Mounted
Components

      Fig. 1 shows a section of a Thermal Carrier Printed Circuit
Card.  Heat from component (A) transfers through thin copper layer
(B) and thermally enhanced insulating layer (C) to heatsink layer (D)
which is typically a thicker copper layer.

      Fig. 2 shows a section of a Thermal Carrier Printed Circuit
Card that has been locally modified to allow a component at (E) to
attach directly to layer (D).  The modification significantly
increases heat transfer from the operating component.  A component
mounted this way must be able to operate with its mounting surface at
ground potential.

      The modification to the Thermal Carrier Circuit Card is
accomplished by coining the material (D) to protrude above layer (B),
then removing the protruding laminations (F) as required to expose
surface (E) of layer (D) which can be used for the mounting of
components.