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Electrophotographic Metallurgical Patterning

IP.com Disclosure Number: IPCOM000109107D
Original Publication Date: 1992-Jul-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 60K

Publishing Venue

IBM

Related People

Diaz, A: AUTHOR [+4]

Abstract

A dry process for the deposition of metallurgical patterns on ceramic precursor sheets, i.e. green sheets, has been developed and over comes limitations associated with the currently practiced screening of metal paste. Paste-sheet interactions are the primarily limitation due to dimensional changes and stresses experienced by the sheet, as well as the minimal line dimension achievable by a screening process. We have developed a dry process utilizing electrophotography as the means of depositing the desired metallurgical pattern. In this process the pattern is defined on a photoconductor surface as a charge and oppositely charged polymer coated metal particles, i.e. like a toner in a photocopier, are transferred to the photoconductor surface, reproducing the desired pattern.

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Electrophotographic Metallurgical Patterning

      A dry process for the deposition of metallurgical patterns on
ceramic precursor sheets, i.e. green sheets, has been developed and
over comes limitations associated with the currently practiced
screening of metal paste.  Paste-sheet interactions are the primarily
limitation due to dimensional changes and stresses experienced by the
sheet, as well as the minimal line dimension achievable by a
screening process.  We have developed a dry process utilizing
electrophotography as the means of depositing the desired
metallurgical pattern.  In this process the pattern is defined on a
photoconductor surface as a charge and oppositely charged polymer
coated metal particles, i.e. like a toner in a photocopier, are
transferred to the photoconductor surface, reproducing the desired
pattern.  The particles are then transferred to the green sheet and
fused/bonded to that surface.  The resulting patterned green sheets
can then be stacked and cofired, with thermal decomposition and
removal of the polymer coating and consolidation of the metal
particles to achieve a conductive metal circuitry within the ceramic
dielectric, analogous to the paste based process.  This process has
been demonstrated for copper coated with poly(methyl methacrylate),
poly(butyryl lactam) or poly(styrene-butyl acrylate).  A
Poly(styrenebutylacrylate) binder with 10-50 wt.% of a sulfonated
poly(styrene-butyl acrylate) as a charge control agent gave the bes...