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Browse Prior Art Database

Modified Solder Fountain Chimney for Wave Solder Simulation

IP.com Disclosure Number: IPCOM000109113D
Original Publication Date: 1992-Jul-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 49K

Publishing Venue

IBM

Related People

Bonnell, RE: AUTHOR [+4]

Abstract

Disclosed is a solder fountain chimney which has been designed to simulate the thermal and solder flow characteristics of a wave soldering tool when coupled with a continuous flow solder fountain having a motorized x,z work table. This simulated "wave solder" solder fountain process has been demonstrated to increase solder fountain bridging yields to equal to or greater than those seen at initial attach with wave solder.

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This is the abbreviated version, containing approximately 98% of the total text.

Modified Solder Fountain Chimney for Wave Solder Simulation

      Disclosed is a solder fountain chimney which has been designed
to simulate the thermal and solder flow characteristics of a wave
soldering tool when coupled with a continuous flow solder fountain
having a motorized x,z work table.  This simulated "wave solder"
solder fountain process has been demonstrated to increase solder
fountain bridging yields to equal to or greater than those seen at
initial attach with wave solder.

      The chimney is shown in the figure below.  The chimney consists
of an asymmetric chimney which is oriented to the process flow so
that the module will enter the chimney from the long side and exit
the short side.  The solder flow is designed to concentrate the heat
at the short "exit end".  The solder is pumped into the chimney at
the exit end of the chimney.  The bulk of the solder flows over the
wire at the entrance side of the chimney and effectively heats up the
card/pins which also cools the solder.  The counter current flow,
however, allows for the maximum heat transfer capability and also
allows for maximum solder temperature at the exit end of the chimney
which minimizes the solder surface tension.  This heat concentration
allows for optimal solder release from the card/pin at exit from the
chimney.  In order to minimize drag out from the chimney over the
exit dam of the chimney, two wires were cut into the sides of the
chimney adjacent to the exit dam.

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