Browse Prior Art Database

High Density, Total Containment, Thin Film Disk, Plating Device

IP.com Disclosure Number: IPCOM000109133D
Original Publication Date: 1992-Jul-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 59K

Publishing Venue

IBM

Related People

Dingfelder, DW: AUTHOR [+5]

Abstract

The high-density, total containment, thin-film disk, plating device allows for double-density loading and also eliminates "disk float off" and "disk stacking" on the plating mandrel during the electroless nickel plating operation. The disk "float off" and "disk stacking" takes place due to the turbulence of the bath and the fluid filtration. The terms "disk float off" and "disk stacking" refer to the movement of one or more disks to adjoining grooves, resulting in degradation of the plating layer. The results of this occurrence are defective parts, or "scrap".

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 86% of the total text.

High Density, Total Containment, Thin Film Disk, Plating Device

      The high-density, total containment, thin-film disk, plating
device allows for double-density loading and also eliminates "disk
float off" and "disk stacking" on the plating mandrel during the
electroless nickel plating operation.  The disk "float off" and "disk
stacking" takes place due to the turbulence of the bath and the fluid
filtration.  The terms "disk float off" and "disk stacking" refer to
the movement of one or more disks to adjoining grooves, resulting in
degradation of the plating layer.  The results of this occurrence are
defective parts, or "scrap".

      The high-density, total containment, thin-film disk, plating
device applies a light uniform pressure across the entire length of
the mandrel load, assuring the proper location of the disks.  The
material that was chosen for this was Poly(vinylidenefluoride) PVDF;
it was chosen because of its inertness to the plating baths and its
density.

      The high-density, total containment, thin-film, plating device
has symmetrically placed fluid dispensation orifices. The orifices
allow the plating bath to flow freely into and out of the plating
load.  This insures complete and uniform plating and rinsing of the
disks, while containing the disks in their respective locations.
Another important function that the high density, total containment,
thin-film, plating device provides is the rotating of the disks on
the mandrel insuring...