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Polyimide Surface Modification by Ozonlysis

IP.com Disclosure Number: IPCOM000109143D
Original Publication Date: 1992-Jul-01
Included in the Prior Art Database: 2005-Mar-23
Document File: 1 page(s) / 46K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+3]

Abstract

Polyimides are an important class of dielectric materials used in microelectronics packaging. The conducting media, usually copper or gold is patterned on polyimide thin films followed by a hermetic sealing of the structure by laminating another polyimide thin film. The polyimide to polyimide and copper to polyimide interface adhesion are crucial characteristics to the reliability and feasibility of the process. The adhesion is promoted by ring-opening the imide linkage to form polyamic acid moities on the surface. Prior art achieves this by caustic base chemicals such as Sodium Hydroxide (NaOH) or Potassium Hydroxide (KOH) treatment of the surface or water plasma treatment. The former is a wet, a two-step process, while the water plasma treatment is very reactive and may attack peripheral sites and parts of the workpiece.

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Polyimide Surface Modification by Ozonlysis

      Polyimides are an important class of dielectric materials used
in microelectronics packaging.  The conducting media, usually copper
or gold is patterned on polyimide thin films followed by a hermetic
sealing of the structure by laminating another polyimide thin film.
The polyimide to polyimide and copper to polyimide interface adhesion
are crucial characteristics to the reliability and feasibility of the
process.  The adhesion is promoted by ring-opening the imide linkage
to form polyamic acid moities on the surface.  Prior art achieves
this by caustic base chemicals such as Sodium Hydroxide (NaOH) or
Potassium Hydroxide (KOH) treatment of the surface or water plasma
treatment.  The former is a wet, a two-step process, while the water
plasma treatment is very reactive and may attack peripheral sites and
parts of the workpiece.

      Disclosed is an inexpensive method that is operable at room
temperature, if required.  The polyimide surface to be adhered to, or
onto is treated with Ultra Violet (UV) Ozone (O3) for 5 to 10
minutes.  The ozone ring opens the imide linkage, thus inducing
adhesion promotion.  The ozone treated surfaces can subsequently be
laminated or seeded by palladium salt, if the application so
requires.  The disclosed method is a dry process, allowing for
modification of polyimide surfaces and promoting adhesion and surface
reactivity for subsequent processes, such as electroless seeding, fo...