Browse Prior Art Database

Power Supply Electromagnetic Grounding and Thermal Enhancement of the Computer System

IP.com Disclosure Number: IPCOM000109366D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 3 page(s) / 108K

Publishing Venue

IBM

Related People

Barina, RM: AUTHOR [+5]

Abstract

The article describes a power supply mounting plate which provides both an electromagnetic compatibility (EMC) seal and a thermal seal.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 64% of the total text.

Power Supply Electromagnetic Grounding and Thermal Enhancement of the Computer System

       The article describes a power supply mounting plate which
provides both an electromagnetic compatibility (EMC) seal and a
thermal seal.

      Typically, internal contact springs have been used to guarantee
or provide EMC shielding between the power supply and the personal
computer (PC) system enclosure.

      Electromagnetic interference is a critical factor in computers.
As the industry continuously pushes for faster and higher frequency
systems, the design criteria and techniques to meet the required
standards also continue to rise.  One of the ways electromagnetic
energy escapes or enters a system is through openings.  The maximum
linear dimension of an opening without radiation concern has to be
1/20th of a signal wavelength.  Typically, the maximum linear
dimension should not be greater than 20 to 25 mm.  Effectiveness of
an EMC seal (shield) is also directly proportional to the continuity,
contact surface and contact pressure of the seal (shield).

      Thermal control is another critical factor in computers.  As
the industry continuously pushes for smaller and faster computers,
the components continue to become smaller but with higher power
densities.  Air leak before effective use cannot be afforded.
Recirculation of used (hot) air has adverse affect on cooling.

      The design disclosed herein is shown in the drawings.  Fig. 1
is a perspecti...